R7FA6E2BB3CNE#BA0
MCU:RA
Quick Answer: The R7FA6E2BB3CNE#BA0 from Renesas Electronics Corporation is a RA6E2 32-bit microcontroller built around an ARM Cortex-M33 core and operating at 200 MHz.
- Manufacturer
- Renesas Electronics Corporation
- Product Category
- Microcontrollers - MCU
- Package
- 48-WFQFN Exposed Pad
- Stock
- 3,328 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Renesas Electronics Corporation |
|---|---|
| Product Category | Microcontrollers - MCU |
| Connectivity | CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit |
| Data Converters | A/D 8x12b SAR; D/A 2x12b |
| EEPROM Size | 4K x 8 |
| Mounting Type | Surface Mount |
| Number of I/O | 29 |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Oscillator Type | Internal |
| Package | Tray |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Product status | Active |
| Program Memory Size | 256KB (256K x 8) |
| Program Memory Type | Flash |
| RAM Size | 40K x 8 |
| Series | RA6E2 |
| Speed | 200MHz |
| Supplier Device Package | 48-HWQFN (7x7) |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 3.6V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for R7FA6E2BB3CNE#BA0.
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Detailed Description for R7FA6E2BB3CNE#BA0
Product Overview
The R7FA6E2BB3CNE#BA0 from Renesas Electronics Corporation is a RA6E2 32-bit microcontroller built around an ARM Cortex-M33 core and operating at 200 MHz. It provides 256KB (256K x 8) of FLASH program memory, 40K x 8 RAM, and 4K x 8 EEPROM for embedded control designs that require processing, working data, and EEPROM storage. The device includes 29 I/O, an internal oscillator, and a 48-HWQFN (7x7) surface-mount package with an exposed pad. It operates from a 2.7V to 3.6V supply and is rated for -40°C to 125°C (TA).
Key Features
- 32-bit ARM Cortex-M33 core operating at 200 MHz.
- 256KB (256K x 8) FLASH program memory, 40K x 8 RAM, and 4K x 8 EEPROM.
- 29 I/O with peripherals including DMA, LVD, POR, PWM, and WDT.
- Communication interfaces include CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, and USB.
- Analog resources include eight 12-bit SAR ADC channels and two 12-bit DAC outputs.
- Surface-mount 48-HWQFN (7x7) package with exposed pad, internal oscillator, and 2.7V to 3.6V supply range.
Applications
- Embedded control boards requiring 32-bit processing, FLASH program memory, and EEPROM storage.
- Interface modules that use CANbus, I2C, SCI, SPI, UART/USART, or USB connectivity.
- Sensor acquisition and signal conditioning subsystems using 12-bit ADC and DAC channels.
- PWM-driven control subsystems with DMA support for data transfer and timing peripherals.
- Wide-ambient embedded devices operating from 2.7V to 3.6V and -40°C to 125°C (TA).
Design & Procurement Notes
Designers should confirm that the 2.7V to 3.6V supply range matches the board power architecture and that the 48-HWQFN (7x7) exposed-pad package is compatible with the chosen PCB land pattern and thermal design. The 29 available I/O should be mapped against required serial, analog, PWM, and general-purpose functions to avoid resource conflicts. The 256KB FLASH, 40K x 8 RAM, and 4K x 8 EEPROM sizes should be evaluated against firmware, data buffering, and parameter storage needs. Communication needs should be checked against the CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, and USB interfaces. The internal oscillator and -40°C to 125°C (TA) rating should be considered for system timing and ambient environment assumptions.
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