PART NUMBER

R7FA4M3AF2CBQ#BC0

MCU:RA

Quick Answer: The R7FA4M3AF2CBQ#BC0 from Renesas Electronics Corporation is a 32-bit ARM Cortex-M33 microcontroller in the RA4M3 series.

Product Category
Microcontrollers - MCU
Package
64-LFBGA
Stock
2,996 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Renesas Electronics Corporation
Product Category Microcontrollers - MCU
Connectivity CANbus, I2C, QSPI, SCI, SPI, UART/USART, USB
Core Processor ARM® Cortex®-M33
Core Size 32-Bit Single-Core
Data Converters A/D 11x12b SAR; D/A 2x12b
EEPROM Size 8K x 8
Mounting Type Surface Mount
Number of I/O 45
Operating Temperature -40°C ~ 85°C (TA)
Oscillator Type Internal
Package Tray
Peripherals Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Product status Active
Program Memory Size 1MB (1M x 8)
Program Memory Type Flash
RAM Size 128K x 8
Series RA4M3
Speed 100MHz
Supplier Device Package 64-LFBGA (6x6)
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for R7FA4M3AF2CBQ#BC0.

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Part Number R7FA4M3AF2CBQ#BC0
Availability 2,996 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for R7FA4M3AF2CBQ#BC0

Product Overview

The R7FA4M3AF2CBQ#BC0 from Renesas Electronics Corporation is a 32-bit ARM Cortex-M33 microcontroller in the RA4M3 series. It operates at 100 MHz and provides 1 MB (1M x 8) of FLASH program memory, 128K x 8 RAM, and 8K x 8 EEPROM. The device supports a 2.7 V to 3.6 V supply range, offers 45 I/O pins, and is housed in a surface-mount 64-LFBGA (6x6) package.

Key Features

  • 32-bit ARM Cortex-M33 core with 100 MHz operating speed.
  • 1 MB (1M x 8) FLASH program memory, 128K x 8 RAM, and 8K x 8 EEPROM.
  • 45 I/O pins and a 2.7 V to 3.6 V supply range.
  • Connectivity includes CANbus, I2C, QSPI, SCI, SPI, UART/USART, and USB.
  • Peripherals include capacitive touch, AES crypto, RSA, SHA, DMA, LVD, POR, PWM, temperature sensor, and WDT.
  • Data converters include 11 x 12-bit SAR ADC and 2 x 12-bit DAC.
  • Internal oscillator and surface-mount 64-LFBGA (6x6) package.
  • Operating temperature range of -40°C to 85°C (TA).

Applications

  • Embedded control subsystems that use 45 I/O pins, PWM, and serial communication interfaces.
  • User-interface modules that combine capacitive touch sensing with USB, SPI, or UART links.
  • Data-acquisition nodes that use 12-bit ADC and DAC resources with CANbus or other serial interfaces.
  • Secure embedded devices that use AES, RSA, and SHA peripherals for cryptographic processing.

Design & Procurement Notes

For design planning, match the board power architecture to the 2.7 V to 3.6 V supply range and verify that the operating environment remains within the -40°C to 85°C (TA) range. The 1 MB FLASH, 128K x 8 RAM, and 8K x 8 EEPROM sizes should be evaluated against firmware, runtime data, and configuration storage needs. Map the 45 I/O pins and interfaces, including CANbus, I2C, QSPI, SCI, SPI, UART/USART, and USB, to the required subsystem connections. Because the device is a surface-mount 64-LFBGA (6x6) package, PCB land pattern, routing, and inspection planning should account for the package footprint. The internal oscillator should be considered when planning the clock architecture, and analog requirements should be checked against the 11 x 12-bit SAR ADC and 2 x 12-bit DAC resources.

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