PART NUMBER

R7FA2E2A32DBY#HC1

IC MCU 32BIT 16KB FLASH 16WLCSP

Quick Answer: The R7FA2E2A32DBY#HC1 from Renesas Electronics Corporation is a 32-bit microcontroller using an ARM Cortex-M23 core at 48MHz.

Product Category
Microcontrollers - MCU
Package
16-UFBGA, WLCSP
Stock
1,994 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Renesas Electronics Corporation
Product Category Microcontrollers - MCU
Connectivity I2C, I3C, SCI, SmartCard, SPI, UART/USART
Core Processor ARM® Cortex®-M23
Core Size 32-Bit
Data Converters A/D 4x12b SAR
EEPROM Size 2K x 8
Mounting Type Surface Mount
Number of I/O 11
Operating Temperature -40°C ~ 85°C (TA)
Oscillator Type Internal
Package Tape & Reel (TR),Cut Tape (CT)
Peripherals AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Product status Active
Program Memory Size 16KB (16K x 8)
Program Memory Type Flash
RAM Size 8K x 8
Series RA2E2
Speed 48MHz
Supplier Device Package 16-WLCSP (1.84x1.87)
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for R7FA2E2A32DBY#HC1.

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Part Number R7FA2E2A32DBY#HC1
Availability 1,994 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for R7FA2E2A32DBY#HC1

Product Overview

The R7FA2E2A32DBY#HC1 from Renesas Electronics Corporation is a 32-bit microcontroller using an ARM Cortex-M23 core at 48MHz. It provides 16KB (16K x 8) FLASH, 8K x 8 RAM, and 2K x 8 EEPROM, with 11 I/O and four 12-bit SAR ADC channels. The device operates from 1.6V to 5.5V, uses an internal oscillator, and is rated for -40°C to 85°C (TA). Supported interfaces include I2C, I3C, SCI, SmartCard, SPI, and UART/USART. On-chip peripherals include AES, DMA, LVD, POR, PWM, a temperature sensor, TRNG, and WDT. The part uses a 16-WLCSP (1.84x1.87) surface-mount package, also identified as 16-UFBGA, WLCSP.

Key Features

  • 32-bit ARM Cortex-M23 core operating at 48MHz.
  • 16KB (16K x 8) FLASH program memory, 8K x 8 RAM, and 2K x 8 EEPROM.
  • 11 I/O pins and four 12-bit SAR analog-to-digital converters.
  • I2C, I3C, SCI, SmartCard, SPI, and UART/USART communication interfaces.
  • AES, TRNG, DMA, PWM, temperature sensor, WDT, LVD, and POR peripherals.
  • 1.6V to 5.5V supply range with an internal oscillator.
  • Operating temperature range of -40°C to 85°C (TA).
  • 16-WLCSP (1.84x1.87) surface-mount package, 16-UFBGA, WLCSP.

Applications

  • Compact embedded control systems needing a 32-bit core, 11 I/O, and a small WLCSP footprint.
  • Sensor acquisition nodes using four 12-bit SAR ADC channels and the internal temperature sensor.
  • Secure local communication endpoints using AES, TRNG, and I2C, I3C, SPI, UART/USART, or SmartCard interfaces.
  • Subsystems powered from 1.6V to 5.5V that require analog measurement and digital control.
  • Motor, actuator, or power-control tasks using PWM outputs and DMA transfers.

Design & Procurement Notes

Design teams should map the 11 I/O count and selected communication interfaces to the PCB architecture before assigning peripherals, because the 16-WLCSP (1.84x1.87) package is compact but provides a limited pin count. The 1.6V to 5.5V supply range supports low-voltage rails and broader supply domains, but decoupling and power sequencing should be verified against the final layout. The internal oscillator provides a clock source for designs operating at 48MHz, while the -40°C to 85°C (TA) range should be considered with the enclosure and PCB thermal environment. For procurement, specify the exact part number R7FA2E2A32DBY#HC1 and the 16-UFBGA, WLCSP package to match the intended memory, peripheral, and interface configuration.

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