ACT4910QW123-T
POWER LOSS PROTECTION WITH 6A EF
Quick Answer: The Qorvo ACT4910QW123-T is a specialized power management integrated circuit intended for solid-state drive systems.
- Manufacturer
- Qorvo
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 28-PowerVFQFN
- Stock
- 2,901 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Qorvo |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Solid State Drives (SSD) |
| Current - Supply | 5.5mA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C |
| Package | Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 28-FCQFN (5x5) |
| Voltage - Supply | 2.7V ~ 18V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for ACT4910QW123-T.
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Detailed Description for ACT4910QW123-T
Product Overview
The Qorvo ACT4910QW123-T is a specialized power management integrated circuit intended for solid-state drive systems. It combines power-loss protection with a 6 A EF function and is packaged in a 28-FCQFN (5 x 5 mm) surface-mount package. The device operates from a 2.7 V to 18 V supply and is specified for -40°C to 105°C operation, supporting compact SSD power subsystems and surface-mount board integration.
Key Features
- Power-loss protection with 6 A EF for solid-state drive power subsystems.
- 2.7 V to 18 V operating supply range.
- 5.5 mA supply current.
- -40°C to 105°C operating temperature range.
- Surface-mount 28-PowerVFQFN package with 28-FCQFN (5 x 5 mm) device footprint.
Applications
- Solid-state drive power-loss protection circuits.
- Solid-state drive power management subsystems.
Design & Procurement Notes
When selecting the Qorvo ACT4910QW123-T, confirm that the SSD board supply remains within 2.7 V to 18 V and that the 5.5 mA supply current is compatible with the upstream power budget. The 28-FCQFN (5 x 5 mm) surface-mount package supports compact placement, but thermal layout should account for the -40°C to 105°C operating range and nearby heat sources. The 6 A EF power-loss protection function should be evaluated against the intended SSD power path and protection requirements. Board assembly should also match the 28-PowerVFQFN footprint and surface-mount construction. These package and temperature characteristics are relevant for dense SSD PCB layouts, component placement, routing, and assembly.
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