MC32PF1550A5EPR2
PF1550
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 40-VFQFN Exposed Pad
- Stock
- 1,490 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
| Min Qty | 5000 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Supplier Device Package | 40-HVQFN (5x5) |
| Voltage - Supply | 3.8V ~ 7V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MC32PF1550A5EPR2.
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Detailed Description for MC32PF1550A5EPR2
Product Overview
The MC32PF1550A5EPR2 from NXP USA Inc. is a PF1550 power management IC for systems that need multiple regulated outputs and battery charging in one surface-mount package. The device accepts a 3.8 V to 7 V supply and is specified for operation from -40°C to 85°C. Its architecture combines three low-dropout regulators, three buck regulators, and a battery charger, supporting compact power distribution for embedded, low-power IoT, and mobile or wearable designs.
Key Features
- PF1550 power management IC integrates three LDO regulators, three buck regulators, and a battery charger.
- Operates from a 3.8 V to 7 V supply input.
- Rated for an operating temperature range of -40°C to 85°C.
- Uses a 40-VFQFN exposed-pad package and a 40-HVQFN (5x5) device package.
- Surface-mount configuration supports compact board layouts.
Applications
- Low-power IoT endpoints that require integrated battery charging and multiple regulated rails.
- Mobile and wearable devices needing a compact power management architecture.
- Embedded systems operating from a 3.8 V to 7 V supply input.
Design & Procurement Notes
When selecting the MC32PF1550A5EPR2, consider the 3.8 V to 7 V input range and the -40°C to 85°C operating temperature envelope for the target assembly. The 40-VFQFN exposed-pad package and 40-HVQFN (5x5) device package require appropriate surface-mount land patterns and assembly processes. The integrated three LDO, three buck, and battery charger functions can reduce component count in compact power systems, but each output and charging requirement should be checked against the PF1550 architecture before finalizing the design.
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