LD6836TD/14P,125

Product Overview

The LD6836TD/14P,125 is a linear voltage regulator integrated circuit from NXP USA Inc. that provides a single positive fixed 1.4 V output at up to 300 mA. The surface-mount 5-TSOP device, also identified as SC-74A or SOT-753, accepts an input voltage up to 5.5 V and includes enable control, overcurrent protection, and overtemperature protection. Its maximum dropout voltage is 0.2 V at 300 mA, and it operates from -40°C to 85°C.

Key Features

• Single positive fixed-output linear regulator delivering 1.4 V at up to 300 mA.
• Maximum input voltage of 5.5 V and maximum dropout of 0.2 V at 300 mA.
• Enable control feature for output on/off control.
• Overcurrent and overtemperature protection features.
• Quiescent current of 100 µA and maximum supply current of 250 µA.
• PSRR of 55 dB at 1 kHz.
• Surface-mount 5-TSOP package, also referenced as SC-74A or SOT-753.
• Operating temperature range of -40°C to 85°C.

Applications

• Creating a fixed 1.4 V rail from an input voltage up to 5.5 V in compact surface-mount assemblies.
• Providing a locally regulated supply for circuits that can be enabled or disabled through the enable control.
• Supplying fixed-voltage loads where a 300 mA output rating and 0.2 V maximum dropout at full load are sufficient.
• Using in small embedded boards where overcurrent and overtemperature protection are desired for the regulated output.
• Powering fixed-voltage loads in designs that need a surface-mount regulator with 55 dB PSRR at 1 kHz.

Design & Procurement Notes

Confirm that the input voltage remains within the 5.5 V maximum and that the load current does not exceed 300 mA. The fixed 1.4 V output and 0.2 V maximum dropout at full load require headroom planning across the -40°C to 85°C range. The enable control supports output on/off management, while overcurrent and overtemperature protection should be treated as safeguards rather than replacements for correct load and thermal margining. The 5-TSOP surface-mount package requires attention to board layout and heat dissipation in the final assembly.