NJG1159PHH-A-TE1

Product Overview

NJG1159PHH-A-TE1 from Nisshinbo Micro Devices Inc. is a RF front-end module / LNA-switch IC used in RF front-end designs that need integrated transmit, receive, switching or low-noise signal-chain functions. This description focuses on practical RF parameters such as band coverage, PA/LNA path behavior, control requirements and package compatibility.

The exact orderable suffix should be matched before purchase because RF front-end devices often vary by band plan, pinout, reel format, qualification grade and control-state truth table.

Key Features

• Manufacturer: Nisshinbo Micro Devices Inc.
• Part Number: NJG1159PHH-A-TE1
• Device Type: RF front-end module / LNA-switch IC
• RF Band / Frequency Range: Cellular, GNSS or WLAN band depending on NJG suffix
• Transmit / PA Path: Switching or front-end support for transmit/receive path selection depending on device
• Receive / LNA Path: Low-noise amplifier receive path and bypass/switch functions in applicable NJG front-end modules
• Output Power / Linearity: RF power handling, gain and NF are suffix-specific; verify Nisshinbo data sheet before design-in
• Control / Bias: Logic-controlled switch/LNA states with low-voltage CMOS compatibility on many NJG families
• System Impedance: 50 Ω RF interface where specified by the device reference design or data sheet
• Package / Case: Ultra-small leadless RF front-end package
• Operating Temperature: RF front-end module temperature range is suffix-specific; verify industrial or automotive grade before sourcing
• Design Notes: Confirm NJG1156/NJG1159/NJG1186 band assignment, pinout and external matching network before substitution.

Applications

Mobile devices, GNSS receivers, cellular RF paths and compact wireless receive front ends.

Also suitable for engineering replacements, shortage support and BOM consolidation where the same RF band, package footprint and control interface must be maintained.

Quality & Sourcing

Antrex Electronics can support sourcing for NJG1159PHH-A-TE1 through available stock checks, BOM consolidation and alternative-lot review. For RF front-end modules, packaging condition, date code, MSL handling, reel labeling and moisture exposure should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers reduce risk when sourcing hard-to-find or lifecycle-sensitive RF front-end components.