ZBT-K283+

Product Overview

ZBT-K283+ from Mini-Circuits is a RF bias tee module used in RF, microwave or wireless front-end designs. This product detail focuses on practical RF function, operating range, control/interface requirements and sourcing relevance for engineering and procurement teams.

The exact suffix should be matched against the original BOM because RF behavior can depend on package, die or reel option, control logic, bias network and qualified operating conditions.

Key Features

• Manufacturer: Mini-Circuits
• Part Number: ZBT-K283+
• Device Type: RF bias tee module
• RF Function: Combines or separates DC bias and RF signal paths for active RF devices
• Frequency Range: wideband RF bias-tee range, verify exact model datasheet
• DC Current / Voltage: ZFBT-6G+ reference family supports 0.5 A DC current and 30 V maximum DC-port voltage; confirm exact model for other variants
• RF Power: ZFBT-6G+ reference family supports 30 dBm maximum RF power; verify exact model rating
• Isolation: DC-to-RF isolation is model dependent; ZFBT-6G+ overview lists 40 dB typical DC-RF isolation
• Connector / Package: Mini-Circuits coaxial or surface-mount bias-tee package defined by suffix
• System Impedance: 50 ohm
• Design Notes: Verify RF port orientation, DC feed port rating and solder/reel option before replacing an installed bias tee.

Applications

RF test equipment, receiver protection, active-device biasing, I/Q networks, microwave modules and lab/production RF signal paths.

Replacement sourcing for Mini-Circuits RF modules where connector style, center frequency and model-specific datasheet values must match the original BOM.

Quality & Sourcing

Antrex Electronics can support sourcing for ZBT-K283+ through available stock checks, BOM consolidation and alternative-lot review. For RF and microwave parts, package marking, date code, MSL handling and original-label condition should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers manage risk when sourcing discontinued, legacy or hard-to-find RF ICs and modules.