T2-1T+
1:2 XFMR, 0.07 - 200 MHZ, 50
Quick Answer: T2-1T+ is a Mini-Circuits 1:2 core-and-wire transformer spanning 70 kHz to 200 MHz.
- Manufacturer
- Mini-Circuits
- Product Category
- RF Baluns
- Package
- 6-SMD, Flat Leads
- Stock
- 1,226 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Mini-Circuits |
|---|---|
| Product Category | RF Baluns |
| Frequency Range | 70kHz ~ 200MHz |
| Impedance - Unbalanced/Balanced | 1:2 |
| ion Loss (Max) | 3.0dB |
| Min Qty | 10 |
| Mounting Type | Surface Mount |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for T2-1T+.
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Detailed Description for T2-1T+
Product Overview
T2-1T+ is a Mini-Circuits 1:2 core-and-wire transformer spanning 70 kHz to 200 MHz. In addition to converting between balanced and unbalanced nodes, the 1:2 ratio provides a defined impedance transformation for matching a 50 Ω source or load to a higher-impedance differential circuit.
Its low-frequency reach and VHF coverage make it useful in IF strips, broadband receivers and transformer-coupled amplifier stages. Designers should treat the impedance ratio, winding orientation and W38 footprint as a set; substituting a 1:1 transformer would change both matching and signal level.
Key Features
- Manufacturer: Mini-Circuits
- Part Number: T2-1T+
- Product Category: RF Balun / RF Transformer
- Device Type: surface-mount 1:2 core-and-wire RF transformer
- Frequency Range: 0.07 MHz to 200 MHz
- System / Port Impedance: 50 Ω
- Impedance Ratio: 1:2
- Package / Case: W38, approximately 0.30 × 0.62 × 0.23 in
- Mounting Type: Surface mount
Applications
- IF and HF/VHF impedance-matching networks
- Balanced mixer and push-pull amplifier coupling
- Broadband receiver inputs requiring a 1:2 transformation
Quality & Sourcing
Antrex Electronics can assist with sourcing T2-1T+ for legacy and current RF assemblies. Transformer substitutions should match the winding ratio, operating band, power/current limits, pin configuration and package footprint.
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