MTFC32GAKAEEF-AIT TR
32GB e.MMC managed NAND Flash memory
Quick Answer: The MTFC32GAKAEEF-AIT from Micron Technology is a 32GB e.MMC managed NAND Flash memory designed to provide embedded systems with compact, non-volatile data and program storage.
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 169-TFBGA
- Stock
- 12,580 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Boot support | Dedicated e.MMC boot operation |
| Data-bus options | 1-bit, 4-bit and 8-bit modes |
| Endurance management | Internal wear-leveling functions |
| Environmental compliance | Lead-free and RoHS-compliant |
| Error management | Internal error-correction and bad-block management |
| Interface | MMC/e.MMC |
| Lifecycle Status | Obsolete / no longer manufactured through normal Micron production channels |
| Main supply voltage | 2.7V to 3.6V |
| Maintenance functions | Background operations and device-health reporting |
| Memory management | Integrated NAND Controller |
| Memory Organization | 32G × 8 |
| Memory Type | Managed NAND Flash |
| Mounting Type | Surface Mount |
| Operating Temperature | −40°C to +85°C |
| Package | 169-ball TFBGA |
| Package Dimensions | 14 × 18mm |
| Packaging Options | Tray or tape and reel, depending on the complete ordering code |
| Partitioning | Supports boot, user-data and protected storage areas |
| Product Family | Micron e.MMC |
| Raw memory density | 256Gbit |
| Security and protection | Write-protection and replay-protected memory functions supported by the e.MMC architecture |
| Storage capacity | 32GB |
| Temperature suffix | AIT, denoting the extended-temperature version for demanding embedded applications |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MTFC32GAKAEEF-AIT TR.
Why Source from Antrex Electronics?
Independent distribution support for verified sourcing, inspection and international procurement requirements.
Independent Distribution Support
Shortage, obsolete and hard-to-find component sourcing for production and procurement requirements.
Traceability Review
Label, lot, date code and available supply-chain documentation can be reviewed before order confirmation.
Inspection & Testing
Visual inspection, X-ray and third-party testing support can be arranged when required.
Global Procurement Support
Support for OEM, EMS, distributors and international sourcing requirements across individual parts and BOM projects.
Credentials & Verification Support
Quality controls, traceability review and inspection support for electronic component sourcing.
Detailed Description for MTFC32GAKAEEF-AIT TR
Product Overview
The MTFC32GAKAEEF-AIT from Micron Technology is a 32GB e.MMC managed NAND Flash memory designed to provide embedded systems with compact, non-volatile data and program storage.
The device combines NAND Flash memory with an integrated e.MMC controller in a single BGA package. The controller handles essential NAND-management operations internally, reducing the storage-management workload placed on the host processor. This makes the component suitable for storing operating systems, application software, configuration data, multimedia content and system logs.
Key Features
Manufacturer: Micron Technology
Part number: MTFC32GAKAEEF-AIT
Product family: Micron e.MMC
Memory type: Managed NAND Flash
Storage capacity: 32GB
Raw memory density: 256Gbit
Memory organization: 32G × 8
Interface: MMC/e.MMC
Data-bus options: 1-bit, 4-bit and 8-bit modes
Main supply voltage: 2.7V to 3.6V
Memory management: Integrated NAND controller
Error management: Internal error-correction and bad-block management
Endurance management: Internal wear-leveling functions
Boot support: Dedicated e.MMC boot operation
Partitioning: Supports boot, user-data and protected storage areas
Security and protection: Write-protection and replay-protected memory functions supported by the e.MMC architecture
Maintenance functions: Background operations and device-health reporting
Operating temperature: −40°C to +85°C
Temperature suffix: AIT, denoting the extended-temperature version for demanding embedded applications
Package: 169-ball TFBGA
Package dimensions: 14 × 18mm
Mounting type: Surface mount
Packaging options: Tray or tape and reel, depending on the complete ordering code
Environmental compliance: Lead-free and RoHS-compliant
Lifecycle status: Obsolete / no longer manufactured through normal Micron production channels
The “TR” designation, when appended to the part number, identifies tape-and-reel packaging. Without TR, the device may be supplied in tray packaging.
Applications
The MTFC32GAKAEEF-AIT is suitable for embedded products that require integrated and reliable non-volatile storage, including:
Industrial control equipment
Factory-automation systems
Automotive infotainment and display systems
Instrument clusters and navigation equipment
Embedded computers and single-board computers
Communication and networking equipment
Medical devices
Data-logging systems
Human-machine interfaces
IoT gateways and edge devices
Point-of-sale terminals
Surveillance and security equipment
Consumer electronics
Operating-system and firmware storage
Because the NAND controller is integrated inside the package, the host processor can access the device through a standardized e.MMC interface instead of directly managing raw NAND Flash.
Quality & Sourcing
Antrex Electronics can help source original MTFC32GAKAEEF-AIT inventory from available factory stock, authorized-channel surplus and traceable OEM or EMS excess inventory. Package photographs, date codes, lot details and available traceability documents can be provided before shipment.
Our component supply and verification services include:
Original and traceable e.MMC inventory sourcing
BOM sourcing and consolidated quotations
Global searches for obsolete and hard-to-find memory products
Factory-label, lot-code and date-code verification
Visual inspection and top-marking verification
X-ray inspection of the internal die and BGA construction
XRF, decapsulation and electrical testing through qualified third-party laboratories
Blank-check, capacity and functional testing where compatible test fixtures are available
International shipping and customized quality documentation
As this device is obsolete, customers should carefully verify the complete ordering code, packaging format, date code and firmware compatibility. e.MMC devices with the same capacity and package are not necessarily drop-in replacements because NAND generation, controller firmware, performance, partition configuration and host qualification requirements may differ.
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