MTFC16GAKAEDQ-AIT TR
IC FLASH 128GBIT MMC 100LBGA
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 100-LBGA
- Stock
- 6,000 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Memory Format | Flash |
| Memory Interface | MMC |
| Memory Organization | 16G x 8 |
| Memory Size | 128Gbit |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Obsolete |
| Series | e•MMC™ |
| Supplier Device Package | 100-LBGA (14x18) |
| Technology | FLASH - NAND |
| Voltage - Supply | 1.7V ~ 1.9V |
| Datasheet | Request Datasheet |
Procurement Snapshot
Key supply and purchasing information for MTFC16GAKAEDQ-AIT TR.
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Detailed Description for MTFC16GAKAEDQ-AIT TR
Product Overview
MTFC16GAKAEDQ-AIT TR from Micron Technology Inc. is a non-volatile FLASH - NAND memory IC offering 128Gbit storage in a 100-LBGA (14x18) surface-mount package. The device uses an MMC memory interface and a 16G x 8 memory organization, with a 1.7V ~ 1.9V supply range and an operating temperature range of -40°C ~ 85°C (TA). It belongs to the e•MMC™ series and is intended for embedded PCB designs that require a compact flash memory component.
Key Features
- 128Gbit non-volatile FLASH memory with NAND technology
- 16G x 8 memory organization for MMC interface integration
- 1.7V ~ 1.9V supply range
- -40°C ~ 85°C (TA) operating temperature range
- 100-LBGA (14x18) surface-mount package
- e•MMC™ series designation
Applications
- Embedded systems that require a compact surface-mount NAND flash storage device accessed through an MMC interface
- Portable electronic assemblies needing non-volatile data retention in a 100-LBGA (14x18) footprint
- PCB-based storage subsystems designed around a 128Gbit flash memory component with a 16G x 8 organization
Design & Procurement Notes
Designers should verify that the host controller supports the MMC interface and the 16G x 8 memory organization before layout. The 1.7V ~ 1.9V supply range and -40°C ~ 85°C (TA) operating temperature range require power and thermal planning appropriate to the board environment. The 100-LBGA (14x18) surface-mount package should be considered for land-pattern, stencil, reflow, and inspection requirements. Because the device is non-volatile FLASH - NAND memory, system firmware should account for flash management behavior within the specified supply and temperature limits. Thermal and power supply margins should be checked against the specified temperature and voltage limits during system-level testing.
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