USB3318-CP-TR
IC TRANSCEIVER 24QFN
Quick Answer: The USB3318-CP-TR is a Microchip Technology interface transceiver intended for USB 2.0 communication links.
- Manufacturer
- Microchip Technology
- Product Category
- Driver, Receiver & Transceiver ICs
- Package
- 24-VFQFN Exposed Pad
- Stock
- 7,807 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | Driver, Receiver & Transceiver ICs |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Series | flexPWR™ |
| Voltage - Supply | 1.8V ~ 3.6V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for USB3318-CP-TR.
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Detailed Description for USB3318-CP-TR
Product Overview
The USB3318-CP-TR is a Microchip Technology interface transceiver intended for USB 2.0 communication links. The device uses a 24-VFQFN exposed-pad surface-mount package with a 4 mm x 4 mm footprint and operates from a 1.8 V to 3.6 V supply. The operating temperature range is -40°C to 85°C, supporting embedded systems that require a USB 2.0 transceiver. The component belongs to the flexPWR™ series and is categorized as an interface driver, receiver, and transceiver.
Key Features
- USB 2.0 protocol support
- Transceiver interface type
- 1.8 V to 3.6 V supply voltage range
- Operating temperature range of -40°C to 85°C
- 24-VFQFN exposed-pad surface-mount package
- 4 mm x 4 mm package footprint
Applications
- Embedded controller boards requiring USB 2.0 connectivity
- Industrial control modules using a USB 2.0 interface
- Test and measurement equipment with USB 2.0 data communication
- Gateway or hub designs needing USB 2.0 transceiver functionality
- Consumer devices that incorporate USB 2.0 data links
Design & Procurement Notes
When selecting USB3318-CP-TR, verify that the board supply can provide 1.8 V to 3.6 V and that the PCB layout accommodates a 24-VFQFN exposed-pad surface-mount package with a 4 mm x 4 mm footprint. Confirm that the operating environment remains within -40°C to 85°C. Because the device is surface mount, pad geometry and assembly process should match the package. The flexPWR™ series designation and USB 2.0 protocol support should be checked against system requirements, and the exposed pad should be considered in PCB thermal and mechanical planning.
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