LAN8710A-EZC-TR-ABC
IC TRANSCEIVER FULL 4/4 32SQFN
Quick Answer: The LAN8710A-EZC-TR-ABC from Microchip Technology is a surface-mount MII and RMII transceiver integrated circuit.
- Manufacturer
- Microchip Technology
- Product Category
- Driver, Receiver & Transceiver ICs
- Package
- -
- Stock
- 4,737 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | Driver, Receiver & Transceiver ICs |
| Operating Temperature | 0°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Voltage - Supply | 1.6V ~ 3.6V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for LAN8710A-EZC-TR-ABC.
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Detailed Description for LAN8710A-EZC-TR-ABC
Product Overview
The LAN8710A-EZC-TR-ABC from Microchip Technology is a surface-mount MII and RMII transceiver integrated circuit. It provides 4/4 driver and receiver channels, full-duplex operation, and a 100 Mbps data rate. It supports full MII and RMII operation in a 32-SQFN package. The 32-VFQFN exposed-pad package has 5x5 package dimensions, operates from a 1.6 V to 3.6 V supply, and is specified for an operating temperature range of 0°C to 85°C.
Key Features
- MII and RMII protocol support for interface connectivity.
- 4/4 driver and receiver configuration with full-duplex operation.
- 100 Mbps data rate.
- 1.6 V to 3.6 V supply voltage range.
- 0°C to 85°C operating temperature range.
- Surface-mount 32-VFQFN exposed-pad package, 32-SQFN (5x5).
- flexPWR series designation.
Applications
- Embedded network connectivity in controller-based devices.
- MII or RMII interface links for processor-based communication subsystems.
- Wired 100 Mbps link segments in communication systems.
- Compact networking modules and boards.
Design & Procurement Notes
When selecting the LAN8710A-EZC-TR-ABC, confirm that the host interface uses MII or RMII and that the board stackup and power rails can support the 1.6 V to 3.6 V supply range. The exposed-pad 32-VFQFN package requires surface-mount assembly and thermal pad layout suitable for the 0°C to 85°C operating range. The 100 Mbps data rate and 4/4 transceiver configuration should be matched to the intended wired link and duplex requirements. Verify that host-side signal levels and PCB routing are compatible with the selected interface and package dimensions. Consider the 5x5 package dimensions during board layout.
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