88E3018-A2-NNC1C000
IC TXRX FULL/HALF 4/4 64QFN
- Manufacturer
- Marvell Semiconductor, Inc.
- Product Category
- Driver, Receiver & Transceiver ICs
- Package
- 64-VFQFN Exposed Pad
- Stock
- 4,422 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Marvell Semiconductor, Inc. |
|---|---|
| Product Category | Driver, Receiver & Transceiver ICs |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package | Tray |
| Product status | Active |
| Series | Alaska® |
| Voltage - Supply | 1.14V ~ 1.26V, 2.38V ~ 2.62V, 3.14V ~ 3.46V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for 88E3018-A2-NNC1C000.
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Detailed Description for 88E3018-A2-NNC1C000
Product Overview
The Marvell Semiconductor, Inc. 88E3018-A2-NNC1C000 is a surface-mount IEEE 802.3 transceiver in a 64-QFN (9x9) package. It provides four drivers and four receivers for full or half duplex operation at 10 Mbps and 100 Mbps, and supports IEEE 1149.1. The device uses 1.14 V to 1.26 V, 2.38 V to 2.62 V, and 3.14 V to 3.46 V supply ranges, with an operating temperature range of 0°C to 70°C (TA). These characteristics support compact board-level integration in systems that require IEEE 802.3 interface functionality.
Key Features
- IEEE 802.3 transceiver with 10 Mbps and 100 Mbps data rates
- Four drivers and four receivers support full and half duplex operation
- Supports IEEE 1149.1
- Operates from 1.14 V to 1.26 V, 2.38 V to 2.62 V, and 3.14 V to 3.46 V
- Surface-mount 64-VFQFN Exposed Pad package with 64-QFN (9x9) body
- Specified for 0°C to 70°C (TA) ambient operation
Applications
- Board-level IEEE 802.3 interface circuitry in embedded controllers
- Full or half duplex 10 Mbps and 100 Mbps communication paths in network equipment
- Four-driver and four-receiver transceiver sections in compact surface-mount designs
Design & Procurement Notes
Design teams should verify that the system power architecture can meet the 1.14 V to 1.26 V, 2.38 V to 2.62 V, and 3.14 V to 3.46 V ranges within the 0°C to 70°C (TA) operating window. The 64-QFN (9x9) exposed-pad package requires surface-mount assembly and footprint alignment with the board thermal pad. For procurement, specify the exact 64-QFN (9x9) package variant to ensure the intended land pattern and assembly process are used. Board and system designs should also confirm compatibility with IEEE 1149.1 and IEEE 802.3 protocol requirements.
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