LFCPNX-50-8BBG484I
IC FPGA CERTUSPRO-NX 484BGA
Quick Answer: The LFCPNX-50-8BBG484I from Lattice Semiconductor Corporation is a CertusPro™-NX field-programmable gate array (FPGA) intended for embedded designs requiring programmable logic, on-chip memory, and I/O resources.
- Manufacturer
- Lattice Semiconductor Corporation
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 484-LFBGA
- Stock
- 1,425 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Lattice Semiconductor Corporation |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | CertusPro™-NX |
| Supplier Device Package | 484-CABGA (19x19) |
| Voltage - Supply | 0.95V ~ 1.05V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for LFCPNX-50-8BBG484I.
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Detailed Description for LFCPNX-50-8BBG484I
Product Overview
The LFCPNX-50-8BBG484I from Lattice Semiconductor Corporation is a CertusPro™-NX field-programmable gate array (FPGA) intended for embedded designs requiring programmable logic, on-chip memory, and I/O resources. It is packaged in a 484-LFBGA surface-mount package, with a 484-CABGA (19x19) package designation. The device offers 52,000 logic elements/cells, 13,000 LABs/CLBs, 1,769,472 total RAM bits, and 273 I/O pins. It operates from a 0.95 V to 1.05 V supply and is specified for a junction temperature range of -40°C to 100°C.
Key Features
- 52,000 logic elements/cells and 13,000 LABs/CLBs
- 1,769,472 total RAM bits
- 273 I/O pins
- 0.95 V to 1.05 V supply range
- 484-LFBGA package with 484-CABGA (19x19) package designation
- Surface-mount mounting type
- Operating junction temperature range of -40°C to 100°C
Applications
- Embedded control logic in board-level systems
- Programmable I/O interfacing and signal routing
- On-chip buffering for data aggregation
Design & Procurement Notes
Designers should size logic, RAM, and I/O usage against the available 52,000 logic elements/cells, 13,000 LABs/CLBs, 1,769,472 total RAM bits, and 273 I/O pins before finalizing the embedded architecture. The 0.95 V to 1.05 V supply range requires a stable low-voltage rail, careful decoupling, and attention to power distribution on the board. The 484-LFBGA surface-mount package and 484-CABGA (19x19) package designation should be verified against the PCB land pattern, solder paste stencil, and routing plan. The -40°C to 100°C junction temperature rating supports thermal verification under expected operating conditions, including board-level thermal management and cooling assumptions.
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