PART NUMBER

XMC1301T016X0016ABXUMA1

IC MCU 32BIT 16KB FLASH 16TSSOP

Quick Answer: The XMC1301T016X0016ABXUMA1 from Infineon Technologies is a 32-bit microcontroller in the XMC1000 series, built around an ARM Cortex-M0 core operating at 32MHz.

Manufacturer
Infineon Technologies
Product Category
Microcontrollers - MCU
Package
16-TSSOP (0.173", 4.40mm Width)
Stock
3,000 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Infineon Technologies
Product Category Microcontrollers - MCU
Connectivity I2C, LINbus, SPI, UART/USART
Core Processor ARM® Cortex®-M0
Core Size 32-Bit Single-Core
Data Converters A/D 11x12b
Mounting Type Surface Mount
Number of I/O 11
Operating Temperature -40°C ~ 105°C (TA)
Oscillator Type Internal
Package Tape & Reel (TR),Cut Tape (CT)
Peripherals Brown-out Detect/Reset, I2S, POR, PWM, WDT
Product status Active
Program Memory Size 16KB (16K x 8)
Program Memory Type Flash
RAM Size 16K x 8
Series XMC1000
Speed 32MHz
Supplier Device Package PG-TSSOP-16-8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for XMC1301T016X0016ABXUMA1.

Check Price & Availability
Part Number XMC1301T016X0016ABXUMA1
Availability 3,000 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for XMC1301T016X0016ABXUMA1

Product Overview

The XMC1301T016X0016ABXUMA1 from Infineon Technologies is a 32-bit microcontroller in the XMC1000 series, built around an ARM Cortex-M0 core operating at 32MHz. It provides 16KB (16K x 8) of FLASH program memory, 16K x 8 of RAM, and 11 I/O lines in a surface-mount PG-TSSOP-16-8 package. The device supports I2C, LINbus, SPI, and UART/USART interfaces, includes an internal oscillator, and is specified for operation from 1.8V to 5.5V across -40°C to 105°C (TA). On-chip peripherals include brown-out detect/reset, I2S, POR, PWM, WDT, and an 11-channel, 12-bit analog-to-digital converter.

Key Features

  • ARM Cortex-M0 32-bit core with 32MHz operating speed.
  • 16KB (16K x 8) FLASH program memory and 16K x 8 RAM.
  • 11 I/O lines and an 11-channel, 12-bit analog-to-digital converter.
  • I2C, LINbus, SPI, and UART/USART connectivity.
  • Peripherals include brown-out detect/reset, I2S, POR, PWM, and WDT.
  • Internal oscillator, 1.8V to 5.5V supply range, and -40°C to 105°C (TA) operating temperature.
  • Surface-mount PG-TSSOP-16-8 package, 16-TSSOP, 4.40mm width.

Applications

  • Embedded control modules that use I2C, LINbus, SPI, or UART/USART for communication with external devices.
  • Sensor measurement subsystems that use the 11-channel, 12-bit analog-to-digital converter and 11 I/O lines for analog and digital signal handling.
  • PWM-based control circuits where pulse-width modulation is used for actuator or driver signals.
  • Compact surface-mount embedded assemblies operating from 1.8V to 5.5V and specified for -40°C to 105°C (TA).

Design & Procurement Notes

Designers should verify that the 16KB FLASH and 16K x 8 RAM are sufficient for the intended firmware and data buffers before committing to the PG-TSSOP-16-8 footprint. The 1.8V to 5.5V supply range allows the device to be paired with logic operating within that range, while the -40°C to 105°C (TA) range should be checked against the final thermal environment. The available I/O count, 11-channel, 12-bit ADC, and selected serial interfaces—especially LINbus, SPI, I2C, or UART/USART—need to match the system architecture. The internal oscillator should be considered when planning clock sources, and the brown-out detect/reset, POR, and WDT features should be configured according to the desired power-on and fault behavior. For board layout, the 16-TSSOP, 4.40mm width package should be considered against PCB density and assembly requirements.

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