CY7C1418BV18-250BZI

Product Overview

This Antrex Electronics technical description covers the CY7C1418BV18-250BZI from Cypress Semiconductor Corp, a volatile synchronous SRAM device organized as 2M x 18 with a 36Mbit capacity. It uses a parallel memory interface and a DDR II synchronous architecture, operating at a 250 MHz clock frequency. The IC uses a 165-FBGA (15x17) surface-mount package, also identified as a 165-LBGA case, and operates from a 1.7 V to 1.9 V supply range with an operating temperature range of -40°C to 85°C (TA).

Key Features

• 36Mbit volatile SRAM memory with 2M x 18 organization
• Synchronous DDR II memory technology with a parallel interface
• 250 MHz clock frequency for synchronous operation
• 1.7 V to 1.9 V supply voltage range
• Operating temperature range of -40°C to 85°C (TA)
• 165-FBGA (15x17) / 165-LBGA surface-mount package

Applications

• High-speed data buffering in networking equipment such as switches and routers
• Packet or frame staging in telecommunications infrastructure
• Memory expansion in embedded controllers and processor systems
• Temporary data storage in measurement and test instruments

Design & Procurement Notes

Designers should confirm that the host controller supports a 2M x 18 parallel synchronous DDR II memory organization and a 250 MHz clock interface before connecting the device. The 1.7 V to 1.9 V supply range requires a compatible power rail and careful decoupling, while the 165-FBGA (15x17) surface-mount package requires appropriate land pattern, via, and assembly planning. Because the memory is volatile, system architecture should account for data loss when power is removed. The -40°C to 85°C operating temperature range should be checked against the final enclosure and board thermal environment. For procurement, verify that the exact Cypress Semiconductor Corp part number, package, and organization match the required bill of materials.