HMC652

Product Overview

HMC652 is a GaAs MMIC digital attenuator die from Analog Devices Inc., selected for the RF and Wireless / Attenuators category. The part is used to control, trim or set RF signal amplitude in RF signal chains where attenuation value, impedance, package style and ordering suffix must match the original bill of materials.

The reviewed sourcing data links this ordering code to broadband RF/microwave die-level coverage, 2 dB attenuation reference, digital attenuation state, 50 Ω impedance reference and Die package or mounting information. These details make the part relevant for RF design, production maintenance, repair and shortage-sourcing projects, while final design approval should always be based on the manufacturer datasheet and the exact suffix being ordered.

Key Features

• Manufacturer: Analog Devices Inc.
• Part Number: HMC652
• Product Category: RF and Wireless / Attenuators
• Device Type: GaAs MMIC digital attenuator die
• Product Description: HMC652 is a GaAs MMIC digital attenuator die for RF signal-level control across broadband RF/microwave die-level coverage, with 2 dB attenuation reference, intended for 50 Ω signal paths and Die assembly or mounting requirements.
• Frequency Range: broadband RF/microwave die-level coverage
• Attenuation Range: 2 dB attenuation reference
• Control / Step Information: digital attenuation state
• Impedance: 50 Ω
• Package / Mounting: Die
• Buying Note: Verify the exact suffix, datasheet revision, package marking and application requirements before production use.

Applications

HMC652 can be used in hybrid microwave modules, chip-and-wire assemblies, radar front ends, E-band or microwave radio modules, aerospace RF assemblies and custom RF signal chains where a bare-die attenuator is required. Assembly process, die handling and bonding requirements should be reviewed carefully before purchasing.

Quality & Sourcing

Antrex Electronics can support HMC652 sourcing with stock availability checks, RFQ quotation, manufacturer and suffix confirmation, package review, date code review and shipment arrangement. Buyers can provide target quantity, required condition, acceptable date code, packaging requirements and application information for faster quotation support. For bare-die products, wafer/die form, storage condition, lot traceability, visual inspection and die handling requirements should be confirmed before purchasing. Product photos, label review, visual inspection and third-party testing support can be arranged when required for OEM, EMS, repair, RF laboratory and electronic component sourcing projects.