HMC424A-SX

Product Overview

HMC424A-SX is a digital step attenuator from Analog Devices Inc., selected for the RF and Wireless / Attenuators category. The part is used to control, trim or set RF signal amplitude in RF signal chains where attenuation value, impedance, package style and ordering suffix must match the original bill of materials.

The reviewed sourcing data links this ordering code to frequency range to be confirmed from the exact datasheet and suffix, 31.5 dB, attenuation control method to be confirmed, 50 Ω nominal RF path when specified by the datasheet impedance reference and Die package or mounting information. These details make the part relevant for RF design, production maintenance, repair and shortage-sourcing projects, while final design approval should always be based on the manufacturer datasheet and the exact suffix being ordered.

Key Features

• Manufacturer: Analog Devices Inc.
• Part Number: HMC424A-SX
• Product Category: RF and Wireless / Attenuators
• Device Type: digital step attenuator
• Product Description: HMC424A-SX is a digital step attenuator for RF signal-level control, with 31.5 dB, intended for 50 Ω nominal RF path when specified by the datasheet signal paths and Die assembly or mounting requirements.
• Attenuation Range: 31.5 dB
• Control / Step Information: attenuation control method to be confirmed
• Impedance: 50 Ω nominal RF path when specified by the datasheet
• Package / Mounting: Die
• Buying Note: Verify the exact suffix, datasheet revision, package marking and application requirements before production use.

Applications

HMC424A-SX can be used in hybrid microwave modules, chip-and-wire assemblies, radar front ends, E-band or microwave radio modules, aerospace RF assemblies and custom RF signal chains where a bare-die attenuator is required. Assembly process, die handling and bonding requirements should be reviewed carefully before purchasing.

Quality & Sourcing

Antrex Electronics can support HMC424A-SX sourcing with stock availability checks, RFQ quotation, manufacturer and suffix confirmation, package review, date code review and shipment arrangement. Buyers can provide target quantity, required condition, acceptable date code, packaging requirements and application information for faster quotation support. For bare-die products, wafer/die form, storage condition, lot traceability, visual inspection and die handling requirements should be confirmed before purchasing. Product photos, label review, visual inspection and third-party testing support can be arranged when required for OEM, EMS, repair, RF laboratory and electronic component sourcing projects.