ADRF5545ABCPZN

Product Overview

ADRF5545ABCPZN from Analog Devices Inc. is a dual-channel receiver front-end module used in RF front-end designs that need integrated transmit, receive, switching or low-noise signal-chain functions. This description focuses on practical RF parameters such as band coverage, PA/LNA path behavior, control requirements and package compatibility.

The exact orderable suffix should be matched before purchase because RF front-end devices often vary by band plan, pinout, reel format, qualification grade and control-state truth table.

Key Features

• Manufacturer: Analog Devices Inc.
• Part Number: ADRF5545ABCPZN
• Device Type: dual-channel receiver front-end module
• RF Band / Frequency Range: 2.4 GHz to 4.2 GHz
• Transmit / PA Path: High-power silicon SPDT switch supports antenna-side protection and TDD RF path routing
• Receive / LNA Path: Two-stage receive LNA chain with about 32 dB high-gain mode gain and 1.45 dB typical noise figure at 3.6 GHz
• Output Power / Linearity: High power handling at elevated case temperature; ADI lists LTE average power handling up to 40 dBm full-lifetime class
• Control / Bias: 5 V supply; high-gain, low-gain and power-down control states with positive logic control
• System Impedance: 50 Ω RF interface where specified by the device reference design or data sheet
• Package / Case: 6 mm x 6 mm, 40-lead LFCSP package
• Operating Temperature: RF front-end module temperature range is suffix-specific; verify industrial or automotive grade before sourcing
• Design Notes: Check ADRF5545A vs ADRF5545 suffix, band coverage and gain-state pins before board replacement.

Applications

TDD LTE/5G infrastructure, small-cell receivers, antenna-array receive modules and high-dynamic-range receiver front ends.

Also suitable for engineering replacements, shortage support and BOM consolidation where the same RF band, package footprint and control interface must be maintained.

Quality & Sourcing

Antrex Electronics can support sourcing for ADRF5545ABCPZN through available stock checks, BOM consolidation and alternative-lot review. For RF front-end modules, packaging condition, date code, MSL handling, reel labeling and moisture exposure should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers reduce risk when sourcing hard-to-find or lifecycle-sensitive RF front-end components.