ADRF5515BCPZN

Product Overview

ADRF5515BCPZN from Analog Devices Inc. is a dual-channel TDD RF receiver front-end module used in RF front-end designs that need integrated transmit, receive, switching or low-noise signal-chain functions. This description focuses on practical RF parameters such as band coverage, PA/LNA path behavior, control requirements and package compatibility.

The exact orderable suffix should be matched before purchase because RF front-end devices often vary by band plan, pinout, reel format, qualification grade and control-state truth table.

Key Features

• Manufacturer: Analog Devices Inc.
• Part Number: ADRF5515BCPZN
• Device Type: dual-channel TDD RF receiver front-end module
• RF Band / Frequency Range: 3.3 GHz to 4.0 GHz
• Transmit / PA Path: High-power SPDT transmit/receive switch path integrated with receive chain
• Receive / LNA Path: Cascaded two-stage LNA with about 33 dB high-gain mode gain and 1.0 dB typical noise figure at 3.6 GHz
• Output Power / Linearity: High power handling for TDD macro/small-cell receiver front ends; confirm maximum RF input and thermal profile from the data sheet
• Control / Bias: 5 V supply family with positive logic control, high/low gain and power-down operating modes
• System Impedance: 50 Ω RF interface where specified by the device reference design or data sheet
• Package / Case: 6 mm x 6 mm, 40-lead LFCSP package
• Operating Temperature: RF front-end module temperature range is suffix-specific; verify industrial or automotive grade before sourcing
• Design Notes: Use the exact ADRF5515/5515A suffix to match band, reel option, LFCSP footprint and receiver-chain gain-state control.

Applications

TDD base-station radios, small-cell receiver front ends, massive-MIMO receive paths and high-linearity wireless infrastructure.

Also suitable for engineering replacements, shortage support and BOM consolidation where the same RF band, package footprint and control interface must be maintained.

Quality & Sourcing

Antrex Electronics can support sourcing for ADRF5515BCPZN through available stock checks, BOM consolidation and alternative-lot review. For RF front-end modules, packaging condition, date code, MSL handling, reel labeling and moisture exposure should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers reduce risk when sourcing hard-to-find or lifecycle-sensitive RF front-end components.