A8837EEJTR-T
IC IGBT DRIVER PHOTOFLASH 10TDFN
Quick Answer: The A8837EEJTR-T from Allegro MicroSystems is a photoflash capacitor charger PMIC with an IGBT driver in a 10-TDFN (3x3) package.
- Manufacturer
- Allegro MicroSystems
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 10-WFDFN Exposed Pad
- Stock
- 2,595 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Allegro MicroSystems |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Photoflash Capacitor Charger |
| Current - Supply | 1.5mA |
| Min Qty | 523 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Bulk |
| Product status | Active |
| Supplier Device Package | 10-TDFN (3x3) |
| Voltage - Supply | 3V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for A8837EEJTR-T.
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Detailed Description for A8837EEJTR-T
Product Overview
The A8837EEJTR-T from Allegro MicroSystems is a photoflash capacitor charger PMIC with an IGBT driver in a 10-TDFN (3x3) package. It operates from a 3 V to 5.5 V supply, draws 1.5 mA supply current, and has an operating temperature range of -40°C to 85°C. The device uses a surface-mount 10-WFDFN exposed-pad package.
Key Features
- Photoflash capacitor charger PMIC with IGBT driver
- Supply voltage range: 3 V to 5.5 V
- Supply current: 1.5 mA
- Operating temperature range: -40°C to 85°C
- Surface-mount 10-WFDFN exposed-pad package, 10-TDFN (3x3)
Applications
- Photoflash capacitor charging circuits
- Camera flash modules
Design & Procurement Notes
When selecting this device, verify that the system supply remains within 3 V to 5.5 V and that the 1.5 mA supply current is compatible with the power budget. The -40°C to 85°C operating temperature range should be checked against the expected operating conditions. For layout, the 10-WFDFN exposed-pad, 10-TDFN (3x3) surface-mount package requires a footprint and thermal pad strategy consistent with the PCB process and flash power stage placement.
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