TPS65070RSLR

Product Overview

The TPS65070RSLR from Texas Instruments is a power management IC (PMIC) with Mobile/OMAP application designation. It provides a five-channel power management architecture with two low-dropout regulators in a 48-VFQFN exposed-pad package, with a 48-VQFN (6x6) package outline. The device supports a supply voltage range of 2.8V to 6.3V and is specified for operation over -40°C to 85°C. Surface-mount packaging and a compact 6 mm x 6 mm body make it suitable for space-constrained board layouts that require multiple regulated rails.

Key Features

• Power management IC with five channels and two low-dropout regulators.
• Supply voltage range: 2.8V to 6.3V.
• Operating temperature range: -40°C to 85°C.
• 48-VFQFN Exposed Pad package with 48-VQFN (6x6) device package.
• Surface-mount mounting type.
• Mobile/OMAP application designation.

Applications

• Mobile/OMAP platforms requiring a dedicated power management IC for multiple system rails.
• Compact embedded designs that need a 48-VQFN (6x6) surface-mount PMIC operating from 2.8V to 6.3V.

Design & Procurement Notes

When selecting the TPS65070RSLR, confirm that the system supply voltage is within 2.8V to 6.3V and that the ambient operating range is within -40°C to 85°C. The 48-VFQFN exposed-pad package requires a matching surface-mount footprint and pad layout. Because the device provides five channels and two low-dropout regulators, the power architecture should be mapped to the available rails before finalizing the design. These package and electrical checks help ensure that the IC can be integrated into a compact Mobile/OMAP or embedded board without exceeding the specified operating conditions.