STPTIC-33G2C5

Product Overview

STPTIC-33G2C5 from STMicroelectronics is a Parascan RF tunable integrated capacitor used in RF, microwave or wireless signal-chain designs. This product detail focuses on the practical RF function, operating range, interface requirements and sourcing relevance for engineering and procurement teams.

The final ordering suffix should be checked against the original bill of materials for package, temperature grade, reel format, firmware option and RF performance before purchase.

Key Features

• Manufacturer: STMicroelectronics
• Part Number: STPTIC-33G2C5
• Device Type: Parascan RF tunable integrated capacitor
• RF Function: BST/Parascan tunable capacitor for adaptive antenna or RF impedance tuning
• Capacitance Family: 33 series nominal capacitance family, exact Cmin/Cmax depends on suffix
• Tuning Ratio: 5:1 tuning range class for STPTIC family
• Linearity: High linearity, with 48x linearity feature noted in STPTIC family documentation
• Quality Factor: High-Q RF tunable passive implementation for mobile-phone antenna tuning
• Package / Case: WLCSP package family around 0.75 mm x 0.94 mm x 0.32 mm for referenced STPTIC variants
• Moisture Sensitivity: WLCSP family listed as MSL 1 in STPTIC documentation
• Design Notes: Confirm capacitance value, control-voltage DAC range and antenna network topology before substitution.

Applications

RF and microwave signal-chain boards, wireless infrastructure, radar modules, satellite/ISM systems and receiver/transmitter support circuits.

Replacement sourcing, shortage support and legacy RF module builds where the exact suffix, package and RF behavior must match the original BOM.

Quality & Sourcing

Antrex Electronics can support sourcing for STPTIC-33G2C5 through available stock checks, BOM consolidation and alternative-lot review. For RF and microwave components, packaging condition, date code, MSL handling and original labeling should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers manage risk when sourcing discontinued, legacy or hard-to-find RF ICs and modules.