MT47H128M16RT-25E IT:C TR

Product Overview

The MT47H128M16RT-25E IT:C TR from Micron Technology Inc. is a DDR2 SDRAM memory integrated circuit for systems that use a parallel DRAM interface. The device provides 2Gbit of volatile memory organized as 128M x 16, with a 400 MHz clock frequency, a 400 ps access time, and a 15ns write cycle time for word and page operations. It operates from a 1.7V to 1.9V supply and is specified for an operating temperature range of -40°C to 95°C at the case. The part uses a surface-mount 84-TFBGA package and an 84-FBGA (9x12.5) package. This configuration supports designs that require a DDR2 memory component with a 16-bit parallel data organization and a defined supply voltage range.

Key Features

• 2Gbit DDR2 SDRAM with a 128M x 16 memory organization and parallel interface.
• 400 MHz clock frequency, 400 ps access time, and 15ns write cycle time for word and page operations.
• 1.7V to 1.9V supply voltage range.
• -40°C to 95°C operating temperature range at the case.
• Surface-mount 84-TFBGA package with an 84-FBGA (9x12.5) package.
• Volatile DRAM memory format for temporary data storage in parallel memory subsystems.
• 16-bit parallel data organization supports connection to DDR2 memory controllers.
• Defined timing and voltage parameters for DDR2 memory interface design.

Applications

• Embedded computing boards that require a parallel DDR2 SDRAM memory device.
• Networking or communication equipment using DDR2 DRAM for temporary data buffering.
• Test and measurement instruments with a DDR2 memory subsystem and a 1.7V to 1.9V supply.
• Control equipment operating over a -40°C to 95°C case temperature range.

Design & Procurement Notes

Designers should verify that the host memory controller supports DDR2 SDRAM with a 16-bit parallel organization, a 400 MHz clock, and the specified write cycle and access timing. The 1.7V to 1.9V supply range should be checked against the system power rails, while the -40°C to 95°C case temperature range should be considered during thermal analysis. The 84-FBGA (9x12.5) surface-mount package requires a matching PCB footprint and reflow profile, and the 2Gbit capacity must align with the intended address map and memory subsystem architecture.