MA4BN1840-2

Product Overview

MA4BN1840-2 from MACOM Technology Solutions is a RF bias network die for PIN diode control circuits used in RF, microwave or wireless front-end designs. This product detail focuses on practical RF function, operating range, control/interface requirements and sourcing relevance for engineering and procurement teams.

The exact suffix should be matched against the original BOM because RF behavior can depend on package, die or reel option, control logic, bias network and qualified operating conditions.

Key Features

• Manufacturer: MACOM Technology Solutions
• Part Number: MA4BN1840-2
• Device Type: RF-DC bias network for PIN diode control circuits
• RF Function: Provides RF-DC decoupling and DC return for biasing PIN diode control circuits
• Construction: Gold backside metallization for RF and DC ground with large bond pads for low-inductance ribbon bonds
• Assembly Method: Suitable for manual or automatic die attach using conductive silver epoxy or compliant solder process
• RF System Role: Bias network companion device for microwave switch, attenuator or limiter assemblies
• Package / Case: Die / chip component with bond-pad style assembly
• Operating Notes: RF grounding and ribbon-bond inductance are critical to bias-network performance
• Design Notes: Use only where die attach and chip-wire assembly processes match the original RF module design.

Applications

PIN diode switch bias networks, RF limiter assemblies, attenuator modules and hybrid microwave control circuits.

Repair and build support for chip-and-wire RF modules that require the original MACOM bias-network die.

Quality & Sourcing

Antrex Electronics can support sourcing for MA4BN1840-2 through available stock checks, BOM consolidation and alternative-lot review. For RF and microwave ICs or modules, packaging condition, date code, MSL handling, ESD control and original labeling should be checked before shipment.

For shortage coverage, repair support or project builds, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers manage risk when sourcing discontinued, legacy or hard-to-find RF miscellaneous ICs and modules.