CY7C15631KV18-450BZC

Product Overview

The Cypress Semiconductor Corp CY7C15631KV18-450BZC is a memory integrated circuit in a surface-mount package. The device is identified as a memory IC with a 165-FBGA (13x15) package designation and a 165-LBGA package/case designation. This packaging places the memory function in a ball-grid array format for printed circuit board layouts that use a surface-mount memory device. The available technical description focuses on its memory function and package form. As with any ball-grid array memory component, board designers should confirm the footprint, land pattern, routing, thermal behavior, and assembly requirements against the full device documentation before finalizing a design.

Key Features

• Memory integrated circuit function in a surface-mount package.
• 165-LBGA package/case designation.
• 165-FBGA (13x15) package designation.
• Ball-grid array format associated with the 165-FBGA package designation.
• Manufacturer part number CY7C15631KV18-450BZC from Cypress Semiconductor Corp.

Applications

• Embedded systems requiring a surface-mount memory IC in a PCB layout.
• Computing hardware using a 165-FBGA memory package for board-level memory integration.
• Data-handling assemblies requiring a 165-LBGA memory device in a surface-mount form factor.

Design & Procurement Notes

When selecting the Cypress Semiconductor Corp CY7C15631KV18-450BZC, the primary technical considerations are its surface-mount mounting type and its 165-LBGA / 165-FBGA (13x15) package form. These package identifiers should be matched against the PCB land pattern, stencil design, routing density, and assembly capability before schematic or layout approval. Because the description identifies the device as a memory IC without additional electrical, timing, voltage, or capacity details, designers should obtain the complete manufacturer documentation for those parameters. Procurement should also verify that the exact part number, package designation, and marking correspond to the intended bill-of-materials entry, since package variants can differ in physical footprint and assembly requirements even when the core memory function is similar.