ADRF5547BCPZN

Product Overview

ADRF5547BCPZN from Analog Devices Inc. is a dual-channel receiver front-end module used in RF front-end designs that need integrated transmit, receive, switching or low-noise signal-chain functions. This description focuses on practical RF parameters such as band coverage, PA/LNA path behavior, control requirements and package compatibility.

The exact orderable suffix should be matched before purchase because RF front-end devices often vary by band plan, pinout, reel format, qualification grade and control-state truth table.

Key Features

• Manufacturer: Analog Devices Inc.
• Part Number: ADRF5547BCPZN
• Device Type: dual-channel receiver front-end module
• RF Band / Frequency Range: 3.0 GHz to 5.0 GHz class receiver front-end band
• Transmit / PA Path: Integrated high-power T/R switch path for TDD receive protection and antenna routing
• Receive / LNA Path: Dual LNA receive channels with high-gain and bypass/low-gain modes for infrastructure receiver chains
• Output Power / Linearity: Infrastructure-grade RF power handling; validate blocker profile and TCASE limit from the ADI data sheet
• Control / Bias: 5 V supply and positive-logic control pins for gain state, switch state and power-down
• System Impedance: 50 Ω RF interface where specified by the device reference design or data sheet
• Package / Case: 6 mm x 6 mm LFCSP-class multichip module
• Operating Temperature: RF front-end module temperature range is suffix-specific; verify industrial or automotive grade before sourcing
• Design Notes: Confirm frequency plan, TDD duty cycle and RF input power profile for the exact ADRF5547 ordering suffix.

Applications

5G NR TDD radios, massive-MIMO receive channels and high-linearity receiver front-end modules.

Also suitable for engineering replacements, shortage support and BOM consolidation where the same RF band, package footprint and control interface must be maintained.

Quality & Sourcing

Antrex Electronics can support sourcing for ADRF5547BCPZN through available stock checks, BOM consolidation and alternative-lot review. For RF front-end modules, packaging condition, date code, MSL handling, reel labeling and moisture exposure should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers reduce risk when sourcing hard-to-find or lifecycle-sensitive RF front-end components.