GL256N11FFA02
256Mbit parallel NOR Flash memory with 110ns access time, 3V operation and high-density non-volatile storage
- 製品カテゴリ
- メモリ IC
- パッケージ
- BGA
- 在庫
- 1,500 pcs
- 供給状況
- 現在の数量は確認が必要です。
製品属性
| メーカー | Infineon Technologies |
|---|---|
| 製品カテゴリ | メモリ IC |
| Access Time | 110ns |
| Applications | Embedded Systems, Industrial Control, Networking Equipment, Automotive Electronics |
| Data Bus Width | 8-bit / 16-bit |
| Data Retention | 20 Years (typ.) |
| Interface Type | Parallel Interface |
| Manufacturer | Spansion / Cypress Semiconductor (Infineon Technologies) |
| Memory Density | 256Mbit |
| Memory Format | Non-Volatile Memory |
| Memory Organization | 32M x 8 / 16M x 16 |
| Memory Type | Parallel NOR Flash |
| Mounting Style | Surface Mount |
| Operating Current | 100mA max. |
| Operating Temperature Range | -40°C to +85°C |
| Operating Voltage | 3.0V |
| Package Size | 13mm × 11mm |
| Package Type | 64-FBGA |
| Product Category | NOR Flash Memory |
| Program/Erase Cycles | 100,000 cycles (typ.) |
| Sector Architecture | Uniform Sector Architecture |
| Series | GL-N Series |
| Standby Current | Low Power Standby Mode |
| Supply Voltage (VCC) | 2.7V to 3.6V |
| Technology | MirrorBit Flash |
| Write Cycle Time | 110ns |
| データシート | データシートを依頼 |
調達概要
GL256N11FFA02 の主要な供給・購買情報です。
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GL256N11FFA02 の詳細説明
Product Overview
GL256N11FFA02 is a Spansion (now Cypress Semiconductor / Infineon Technologies) GL-N series parallel NOR Flash memory device. It provides 256Mbit non-volatile storage capacity with a 3.0V operating voltage and fast asynchronous access performance. Featuring MirrorBit™ technology, high-density storage, low power consumption and reliable data retention, this device is designed for embedded systems requiring firmware storage and code execution capability. The device is supplied in a 64-FBGA package and is commonly used in industrial, networking and communication applications. :contentReference[oaicite:0]{index=0}
Key Features
Manufacturer: Spansion / Cypress Semiconductor / Infineon Technologies
Part Number: GL256N11FFA02
Device Type: Parallel NOR Flash Memory
Product Family: GL-N Series
Memory Technology: MirrorBit™ NOR Flash
Memory Density: 256Mbit
Memory Organization: 32M x 8-bit / 16M x 16-bit
Interface Type: Parallel Interface
Access Time: 110ns
Operating Voltage: 2.7V to 3.6V
Typical Supply Voltage: 3.0V
Memory Architecture: Asynchronous Read Architecture
Boot Sector Architecture: Supported
Write Buffer Programming: Supported
Program Operation: Embedded Programming Algorithm
Erase Operation: Sector Erase Architecture
Data Retention: Long-Term Non-Volatile Data Storage
Operating Temperature Range: -40°C to +85°C
Package Type: 64-FBGA
Package Size: Approximately 13mm × 11mm
Mounting Type: Surface Mount Technology (SMD)
RoHS Status: RoHS Compliant Versions Available
Low Power CMOS Technology
Fast Random Access Memory Performance
Application Type: Embedded Firmware and Data Storage
Typical Applications: Industrial Controllers, Networking Equipment, Telecom Systems, Automotive Electronics and Embedded Computing Platforms
Lifecycle Status: Legacy / Obsolete Product
Ordering Note: Verify package suffix, speed grade, temperature rating and replacement compatibility before production use.
Applications
GL256N11FFA02 is designed for embedded applications requiring high-density non-volatile memory and fast code access. Typical applications include industrial automation systems, network equipment, communication infrastructure, automotive control modules, medical equipment and embedded processors requiring external firmware storage. :contentReference[oaicite:1]{index=1}
Quality & Sourcing
Antrex Electronics can support GL256N11FFA02 sourcing with stock availability checks, RFQ quotation, manufacturer verification, date code review and shipment arrangement. For memory IC sourcing projects, buyers can provide quantity requirements, acceptable date codes, package specifications and application details for faster quotation support.
For quality control, Antrex Electronics can help arrange product photos, marking verification, visual inspection and third-party testing when required. OEMs, EMS providers, industrial equipment manufacturers and repair centers are welcome to send BOM lists or hard-to-find memory component requests.
Datasheet
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