XCVU37P-3FSVH2892E

Product Overview

The XCVU37P-3FSVH2892E is an AMD Virtex UltraScale+ field-programmable gate array (FPGA) for embedded digital systems that use configurable logic, on-chip memory, and 624 I/O pins. The device contains 2,851,800 logic cells and 162,960 LABs/CLBs, with 74,344,038 total RAM bits. It uses a surface-mount 2892-BBGA, FCBGA package with a 2892-FCBGA (55x55) device package designation. The supply voltage range is 0.873V to 0.927V, and the operating temperature range is 0°C to 100°C (TJ).

Key Features

• AMD Virtex UltraScale+ FPGA architecture for embedded programmable logic designs
• 2,851,800 logic cells and 162,960 LABs/CLBs form the configurable logic fabric
• 74,344,038 total RAM bits provide on-chip memory resources
• 624 I/O pins support external device connections and interface logic
• Supply voltage range: 0.873V to 0.927V
• Surface-mount 2892-BBGA, FCBGA package; device package: 2892-FCBGA (55x55)
• Operating temperature range: 0°C to 100°C (TJ)

Applications

• Configurable digital control logic in embedded systems
• Data path management in communications equipment
• Sensor interface and digital signal processing in instrumentation systems
• Interface adaptation and protocol handling in complex digital designs

Design & Procurement Notes

When selecting the XCVU37P-3FSVH2892E, verify that the board layout can accommodate the 2892-FCBGA (55x55) surface-mount package and that thermal management maintains the junction temperature within 0°C to 100°C. The 624 I/O pins, 74,344,038 total RAM bits, and 2,851,800 logic cells require resource planning for logic, memory, and I/O assignment. The 0.873V to 0.927V supply voltage range should be matched by the power delivery design, and the 2892-BBGA, FCBGA package and 55x55 footprint require early mechanical and electrical layout planning.